Description
The LASA LI-NC-0 No Clean Soldering Flux is a high-performance low solids, no-clean flux specially formulated for electronics soldering applications. Designed using a non-halide activator system with a small percentage of rosin, this flux ensures excellent solder wetting, improved joint quality, and minimal post-solder residue.
This product is ideal for PCB assembly, wave soldering, dip soldering, and general electronics repair, offering a clean and efficient soldering experience without the need for extensive cleaning.
The residue left after soldering is minimal, non-corrosive, and non-conductive, making it suitable for applications where post-cleaning is not practical.
🔧 Key Features
- No-clean flux formulation
- Low solids content (~3.3%)
- Non-corrosive and non-conductive residue
- Excellent solder wetting performance
- Halogen-free formulation
- Minimal residue after soldering
- Suitable for wave, dip, spray, and foam applications
- Improves solder joint reliability
- Compatible with automated and manual soldering
- Easy cleaning (if required) using IPA
⚙️ Why Choose No Clean Soldering Flux
The LASA LI-NC-0 flux is designed for modern electronics where cleanliness and reliability are critical.
Advantages:
- Eliminates need for cleaning
- Improves solder flow and adhesion
- Reduces oxidation during soldering
- Prevents weak or dry solder joints
- Saves time and cost in production
- Ideal for high-speed manufacturing
This makes it perfect for both industrial use and DIY electronics projects.
📊 Technical Specifications (From Datasheet)
| Parameter | Specification |
|---|---|
| Product Name | LASA LI-NC-0 No Clean Flux |
| Type | No-Clean, Low Solids Flux |
| Appearance | Clear, Pale Yellow Liquid |
| Solids Content | ~3.3% |
| Specific Gravity | 0.795 ± 0.005 |
| Acid Number | 15 ± 1.5 mg KOH/g |
| Halide Content | None |
| Classification | IPC L3CN |
| Water Extract Resistivity | 35,000 Ω-cm |
| Flash Point | 13°C |
| Shelf Life | ~360 days |
| Cleaning | Not required (optional IPA cleaning) |
🔥 Performance Characteristics
The LASA LI-NC-0 No Clean Flux provides:
- Excellent wetting on copper surfaces
- Smooth solder flow
- Minimal residue formation
- High insulation resistance
- Strong solder joints
- Reduced solder defects
- Consistent performance in production
It also passes key tests like:
- Copper mirror test
- Corrosion test
- Silver chromate test
Ensuring high reliability in electronics manufacturing.
🔌 Applications
This flux is widely used in:
- PCB soldering
- Wave soldering
- Dip soldering
- Spray fluxing systems
- Foam fluxing systems
- Electronics manufacturing
- Industrial assembly lines
- Arduino & DIY projects
- Mobile and electronics repair
- LED board soldering
It is suitable for both manual and automated soldering processes.
🧪 Application Guidelines
- Apply using spray, foam, wave, or mist method
- Recommended flux density: 500–1500 µg/in²
- Preheating improves soldering performance
- Maintain proper temperature for best results
- Ensure uniform flux coating
⚙️ Process Control
- Use clean compressed air (oil & water free)
- Maintain proper foam height for uniform application
- Add thinner to maintain composition balance
- Regularly clean flux system equipment
❄️ Storage & Handling
- Store in sealed container
- Keep away from heat and direct sunlight
- Highly flammable – handle with care
- Use protective gloves and mask
- Ensure proper ventilation
🧼 Cleaning
- Cleaning is not required in most cases
- Residue is safe and non-conductive
- Can be cleaned using IPA (Isopropyl Alcohol) if needed
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